Tessolve
Off Campus Recruitment Drive 2022 | HIRING FOR Test Engineer
& Test Engineer/Trainee/Interns | C.T.C: 4 LPA
Job Location: Bangalore and Vizag
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JOB DESCRIPTION
As a Test engineering, the candidate will be largely
Involved in various conversion / NPI projects & Responsible to bring up
devices on new ATE platform which includes working with a team in providing
Hardware Design and Test program development and solutions for complex
Analog/Power/Mixed Signal /Digital SOC Semiconductor ICs on leading ATE systems
Know more visit us https://www.tessolve.com/test-engineering/ or https://www.youtube.com/watch?v=3VB0aZB_sQ0&t=102s
Eligibility
- B.E/
B.Tech [ Electronics & Communication (ECE) / Electrical &
Electronics (EEE)/ Electronics & Instrumentation Engineering ( EIE) /
Electrical Engineering (EE) ]
- 2021
/ 2022 Batch.
- Candidates
with 1 year experience in electronic industry can also apply.
- Percentage-
65% or 6.5 CGPA
- Job
Location: Bangalore and Vizag
- 3
Years of Service Agreement
Skills
- Good
Knowledge, Practical outlook & understanding of Basic Electronics
fundamentals (Analog / Digital) components, network analysis & circuit
theory is a must.
- Familiar
using all common electronic bench equipment like oscilloscope, DMM, logic
analyser efficiently a must.
- C
-programming is a good / must have or any other programming language
knowledge is an added advantage.
- Proactive
and keen to explore and learn and interested to work in Test Engineering
domain of semiconductor IC industry.
- Good
verbal and written English communication skill.
ABOUT US
Tessolve offers a unique combination of pre-silicon and
post-silicon expertise to provide an efficient turnkey solution for silicon
bring-up, spec to the product. With 2500+ employees worldwide, Tessolve
provides a one-stop-shop solution with full-fledged hardware and software
capabilities, including its advanced silicon and system testing labs. Tessolve
offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s
design services include solutions on advanced process nodes with a healthy
eco-system relationship with EDA, IP, and foundries. Our front-end design
strengths integrated with the knowledge from the backend flow, allows Tessolve
to catch design flaws ahead in the cycle, thus reducing expensive re-design
costs, and risks. We are actively investing in the R&D centre of excellence
initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level
test, and others. Tessolve also offers end-to-end product design services in
the embedded domain from concept to manufacturing under an ODM model with
application expertise in Avionics, Automotive, Industrial and Medical segments.
Tessolve’s Embedded Engineering services enable customers a faster
time-to-market through deep domain expertise, innovative ideas, diverse
embedded hardware & software services, and built-in infrastructure with
world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across
multiple market segments, 7 of the top 10 semiconductor companies, start-ups,
and government entities. We have a global presence with office locations in the
United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK,
Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia,
Austin, San Jose.
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