Saturday, March 26, 2022

Tessolve Off Campus Recruitment Drive 2022 | HIRING FOR Test Engineer & Test Engineer/Trainee/Interns | C.T.C: 4 LPA

Tessolve Off Campus Recruitment Drive 2022 | HIRING FOR Test Engineer & Test Engineer/Trainee/Interns | C.T.C: 4 LPA

Job Location: Bangalore and Vizag

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JOB DESCRIPTION

As a Test engineering, the candidate will be largely Involved in various conversion / NPI projects & Responsible to bring up devices on new ATE platform which includes working with a team in providing Hardware Design and Test program development and solutions for complex Analog/Power/Mixed Signal /Digital SOC Semiconductor ICs on leading ATE systems

Know more visit us https://www.tessolve.com/test-engineering/ or https://www.youtube.com/watch?v=3VB0aZB_sQ0&t=102s

Eligibility

  • B.E/ B.Tech [ Electronics & Communication (ECE) / Electrical & Electronics (EEE)/ Electronics & Instrumentation Engineering ( EIE) / Electrical Engineering (EE) ]
  • 2021 / 2022 Batch.
  • Candidates with 1 year experience in electronic industry can also apply.
  • Percentage- 65% or 6.5 CGPA
  • Job Location: Bangalore and Vizag
  • 3 Years of Service Agreement

 

Skills

  • Good Knowledge, Practical outlook & understanding of Basic Electronics fundamentals (Analog / Digital) components, network analysis & circuit theory is a must.
  • Familiar using all common electronic bench equipment like oscilloscope, DMM, logic analyser efficiently a must.
  • C -programming is a good / must have or any other programming language knowledge is an added advantage.
  • Proactive and keen to explore and learn and interested to work in Test Engineering domain of semiconductor IC industry.
  • Good verbal and written English communication skill.

ABOUT US

Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, spec to the product. With 2500+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolve’s design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We are actively investing in the R&D centre of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across multiple market segments, 7 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, China, UK, Japan, Thailand, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose.

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